Tool Specs

• Etching of silicon, Germanium ,oxide, nitride, carbide,polymer & dielectrics.

• Gases on Fluorine-based module: O2, Ar, N2, SF6, CF4, CHF3,C4F8.

• 3 KW, 2 MHz Rf generator for 415V 50 Hz ICP 380 source.

• RF powered lower electrode- 600 W,13.56 MHz generator.

• Helium assisted cooling for heat transfer.

• Julabo heater/Chiller unit for temperature from -30C to +80C

• Wafers or carrier plate up to 150mm dia.

• 2,3,4,6 inch quartz clamp

• Laser Interferometer 675nm, end point detector.

Contact persons: Smitha Nair , Vamsi Krishna

Training Rules

• Users are requested to submit the online training form (at least a day prior to the training slot) given in the link below.
• Before starting of the training user should go through the training document/manual (see tool operating manual link below).
• User should undergo hands on training given by the tool owner.
• After the hands on training, please contact the tool owner to fix subsequent practice sessions. A minimum of four such sessions are needed before authorization.
• Authorization of the user will depend upon a test conducted by the tool owner or technology manager.
• After the process is done; authorized users must enter the login/process details in the excel sheet which is at the cleanroom Dry Etch computer desktop.
• Incase authorized users misuse the tool or breach the dry etch/cleanroom protocols authorization will be cancelled.

Training Schedule

RIE ( same training for both Cl and F chemistry)
Days: First and 3rd Tuesdays of each month.
Slot timings: 14:30 till 17:30 Hours

Documents

1. User manuals

2. Recipes

Training Status

Click here to book slots for using the equipment